Browsing by Collaborator "Kyushu University (Fukuoka, Japan)"
Now showing items 1-5 of 5
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3D FPGA versus multiple FPGA system : enhanced parallelism in smaller area
(2014-01)Handling large amounts of data is being limited by bandwidth constraint between processors components and their memory counterparts. Three-dimensional integration (3D) is providing possible solution to handle such critical ... -
A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias
(Elsevier, 2016)The use of short Through-Silicon Vias (TSVs) in 3D integration Technology introduces a significant reduction in routing area, power consumption, and delay. Although, there are still several challenges in 3D integration ... -
Modeling the impact of clustering on the lifetime of wireless sensor networks
(2015-03)Energy efficiency and network lifetime are the most critical issues for Wireless Sensor Networks (WSNs). Clustering is one of the well-known techniques for reducing energy consumption of the network and improving its ... -
A neuro-fuzzy fan speed controller for dynamic thermal management of multi-core processors
(ACM DL (Digital Library), 2014-05)Cooling equipments is a thermal management technique that reduces the thermal resistance of the heat sink without any performance degradation. However, higher fan speed produces a lower thermal resistance, but at the expense ... -
Physical-aware predictive dynamic thermal management of multi-core processors
(Elsevier, 2016-03-30)The advances in silicon process technology have made it possible to have processors with larger number of cores. The increment of cores number has been hindered by increasing power consumption and heat dissipation due to ...
